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- Keywords electroless plating;Fe-WP alloy;morphology; 化学镀;铁钨磷合金;形貌;
- Keywords electroless plating;solderable;tin based alloy; 化学镀;可焊性;锡基合金;
- Keywords electroless plating solution;Ni-plating;formular design; 化学镀溶液;镀镍;配方设计;
- Keywords electroless plating;precipitator;cenosphere;metal coating; 化学镀;沉珠;漂珠;金属化;
- Keywords electroless plating;carbon fiber;spinel;composite material;strengthening and toughening; 化学镀;碳纤维;镁铝尖晶石;复合材料;强韧化;
- Keywords electroless plating;Si 3N 4;Co-P alloy coating;metal composited ceramic powder; 化学镀;氮化硅;钴磷合金膜;金属复合陶瓷粉;
- Keywords Electroless plating;Silver;Modified polystyrene spheres;Triethanolamine; 化学镀;银;改性聚苯乙烯微球;三乙醇胺;
- Keywords electroless plating electroless composite plating polytetrafluoroethylene（PTFE）; 化学镀;化学复合镀;聚四氟乙烯（PTFE）;
- Keywords electroless plating;graphite;composite material;wettability;interracial combination; 化学镀;石墨;复合材料;润湿性;界面结合;
- Keywords Electroless plating;Ultrasonic;Mechanism;Technologic parameter;Deposite rater porosity; 化学镀;超声波;机理;工艺条件;沉积速率;孔隙率;
- Keywords electroless plating;regeneration;glassfiber;Ni-W-P alloy;calcium acetate; 化学镀;再生;玻璃纤维;镍钨磷合金;乙酸钙;
- Keywords electroless plating;palladium composite membrane;porous stainless-steel;activation;kinetic equation;permeance performance; 化学镀;把复合膜;多孔不锈钢;活化;动力学方程;渗透性能;
- Study of electroless plating for copper hohlraum fabrication[J]. 引用该论文 万小波;张林;周兰;肖江.
- Electroless plating and characteristics of hohlraum Cu target[J]. 引用该论文 刘继光;万小波;付渠;周兰;宋红文;肖江.
- Electroless plating method is applied to metallize the AlN sbstrate. 应用化学镀镍的方法实现了氮化铝的金属化。
- Coat the surface with either nickel or copper (nickel is now generally the preferred commercial process) from an electroless plating solution. 用镍或者铜在无镀电镀液中进行表面处理，目前镍是更流行的商业用工艺。
- The outer surface of pin is nanocrystallized and the inner surface of bush is carried out Ni-P electroless plating. 将销轴外表面纳米化,套筒内表面进行N i-P化学镀处理,组装成链条,进行了链条磨损性能实验。
- It can obtain many functional coatings by means of electroless plating to meet with the need of electronic industry. 采用化学镀方法在电子陶瓷表面可获得多种功能性镀层,满足电子工业的需要。
- Mechanisms of delamination, void defects in electroless plating and nonuniformity in electroplate were introduced. 重点介绍了钻孔中分层、化学镀铜中的气泡缺陷、电镀中的镀层不均匀等缺陷产生的机理。
- Thus, in general, the conductive paint spray method and the electroless plating method have been currently used. 这样，目前普遍使用的是导电涂料喷雾法。
